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Author: Koh Young America
Publisher:
ISBN: 9781737023210
Category :
Languages : en
Pages : 0
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Book Description
Brent Fischthal: Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed (or soldered). Now technologists are also using AOI pre-reflow to ensure parts are placed correctly before they are soldered into place.Beyond their job of identifying errors and preventing incorrect boards from continuing along the line, these inspection processes provide the data needed to improve the performance of the entire line. SPI and AOI can both be used to make live line adjustments to improve quality without stopping the line, and to provide data that helps identify the root causes of failures or variances.For companies to succeed in the development of Industry 4.0-and perhaps even beyond as we drive toward manufacturing autonomy-they will need inspection solutions, and inspection partners, that can combine domain expertise in optical inspection (vision and software) with the ability to connect to larger systems and contribute to process improvement utilizing tools like artificial intelligence.
Author: Koh Young America
Publisher:
ISBN: 9781737023210
Category :
Languages : en
Pages : 0
Get Book
Book Description
Brent Fischthal: Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed (or soldered). Now technologists are also using AOI pre-reflow to ensure parts are placed correctly before they are soldered into place.Beyond their job of identifying errors and preventing incorrect boards from continuing along the line, these inspection processes provide the data needed to improve the performance of the entire line. SPI and AOI can both be used to make live line adjustments to improve quality without stopping the line, and to provide data that helps identify the root causes of failures or variances.For companies to succeed in the development of Industry 4.0-and perhaps even beyond as we drive toward manufacturing autonomy-they will need inspection solutions, and inspection partners, that can combine domain expertise in optical inspection (vision and software) with the ability to connect to larger systems and contribute to process improvement utilizing tools like artificial intelligence.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author: Casimer DeCusatis
Publisher: Academic Press
ISBN: 9780080533483
Category : Science
Languages : en
Pages : 823
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Book Description
The Handbook includes chapters on all the major industry standards, quick reference tables, helpful appendices, plus a new glossary and list of acronyms. This practical handbook can stand alone or as a companion volume to DeCusatis: Fiber Optic Data Communication: Technological Advances and Trends (February 2002, ISBN: 0-12-207892-6), which was developed in tandem with this book. * Includes emerging technologies such as Infiniband, 10 Gigabit Ethernet, and MPLS Optical Switching * Describes leading edge commercial products, including LEAF and MetroCore fibers, dense wavelength multiplexing, and Small Form Factor transceiver packages * Covers all major industry standards, often written by the same people who designed the standards themselves * Includes an expanded listing of references on the World Wide Web, plus hard-to-find references for international, homologation, and type approval requirements * Convenient tables of key optical datacom parameters and glossary with hundreds of definitions and acronyms * Industry buzzwords explained, including SAN, NAS, and MAN networking * Datacom market analysis and future projections from industry leading forecasters
Author: P. Singh
Publisher: Springer Science & Business Media
ISBN: 1461560292
Category : Technology & Engineering
Languages : en
Pages : 391
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Book Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author: Ray Prasad
Publisher: Springer Science & Business Media
ISBN: 1461540844
Category : Technology & Engineering
Languages : en
Pages : 791
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Book Description
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Author: Michael W. Whalen
Publisher: TU Wien Academic Press
ISBN: 3854480466
Category : Computers
Languages : en
Pages : 297
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Book Description
Our life is dominated by hardware: a USB stick, the processor in our laptops or the SIM card in our smart phone. But who or what makes sure that these systems work stably, safely and securely from the word go? The computer - with a little help from humans. The overall name for this is CAD (computer-aided design), and it’s become hard to imagine our modern industrial world without it. So how can we be sure that the hardware and computer systems we use are reliable? By using formal methods: these are techniques and tools to calculate whether a system description is in itself consistent or whether requirements have been developed and implemented correctly. Or to put it another way: they can be used to check the safety and security of hardware and software. Just how this works in real life was also of interest at the annual conference on "Formal Methods in Computer-Aided Design (FMCAD)". Under the direction of Ruzica Piskac and Michael Whalen, the 21st Conference in October 2021 addressed the results of the latest research in the field of formal methods. A volume of conference proceedings with over 30 articles covering a wide range of formal methods has now been published for this online conference: starting from the verification of hardware, parallel and distributed systems as well as neuronal networks, right through to machine learning and decision-making procedures. This volume provides a fascinating insight into revolutionary methods, technologies, theoretical results and tools for formal logic in computer systems and system developments.
Author: Randy Frank
Publisher: Artech House Publishers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 296
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Book Description
"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology". -- I&CS
Author: Horst Czichos
Publisher: Springer Science & Business Media
ISBN: 3642258506
Category : Technology & Engineering
Languages : en
Pages : 560
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Book Description
This book presents concepts, methods and techniques to examine symptoms of faults and failures of structures, systems and components and to monitor functional performance and structural integrity. The book is organized in five parts. Part A introduces the scope and application of technical diagnostics and gives a comprehensive overview of the physics of failure. Part B presents all relevant methods and techniques for diagnostics and monitoring: from stress, strain, vibration analysis, nondestructive evaluation, thermography and industrial radiology to computed tomography and subsurface microstructural analysis. Part C cores the principles and concepts of technical failure analysis, illustrates case studies, and outlines machinery diagnostics with an emphasis on tribological systems. Part D describes the application of structural health monitoring and performance control to plants and the technical infrastructure, including buildings, bridges, pipelines, electric power stations, offshore wind structures, and railway systems. And finally, Part E is an excursion on diagnostics in arts and culture. The book integrates knowledge of basic sciences and engineering disciplines with contributions from research institutions, academe, and industry, written by internationally known experts from various parts of the world, including Europe, Canada, India, Japan, and USA.
Author: Happy Holden
Publisher:
ISBN: 9780998040202
Category :
Languages : en
Pages : 140
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Book Description
Written by Happy Holden, I-Connect007 consulting technical editor with over 47 years of industry experience, this book provides an in-depth look at automation, computer-integrated and computer-aided manufacturing, mechanization, and chemical monitoring and control. Happy provides examples and descriptions of numerous devices, processes, and systems that can be easily implemented into the supply chain.
Author: Indium Corporation
Publisher:
ISBN: 9781737023289
Category :
Languages : en
Pages :
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Book Description
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. Indium Corporations' Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
