The International Journal for Hybrid Microelectronics PDF Download
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Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 362
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 362
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Book Description
Author: Phillipe Cognard
Publisher: Elsevier
ISBN: 0080534090
Category : Technology & Engineering
Languages : en
Pages : 398
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Book Description
Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives Every scientific and technical issue concerning every chemical type in every industry Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Author: Andre Heck
Publisher: Springer Science & Business Media
ISBN: 9781402019258
Category : Science
Languages : en
Pages : 1132
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Book Description
With about 200,000 entries, StarBriefs Plus represents the most comprehensive and accurately validated collection of abbreviations, acronyms, contractions and symbols within astronomy, related space sciences and other related fields. As such, this invaluable reference source (and its companion volume, StarGuides Plus) should be on the reference shelf of every library, organization or individual with any interest in these areas. Besides astronomy and associated space sciences, related fields such as aeronautics, aeronomy, astronautics, atmospheric sciences, chemistry, communications, computer sciences, data processing, education, electronics, engineering, energetics, environment, geodesy, geophysics, information handling, management, mathematics, meteorology, optics, physics, remote sensing, and so on, are also covered when justified. Terms in common use and/or of general interest have also been included where appropriate.
Author:
Publisher: Springer Science & Business Media
ISBN: 940114351X
Category : Science
Languages : en
Pages : 805
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Book Description
This compilation probably looks like one of the craziest things a human being could spend his or her time on. Yet nobody would wonder at someone taking a short walk every day - after twenty five years that person would have covered a surprisingly long distance. This is exactly the story behind this list, which appeared first as a few pages within the directory StarGuides (or whatever name it had at that time) and as a distinct sister publication since 1990. The idea behind this dictionary is to offer astronomers and related space scientists practical assistance in decoding the numerous abbreviations, acronyms, contractions and symbols which they might encounter in all aspects of the vast range of their professional activities, including traveling. Perhaps it is a bit paradoxical, but if scientists quickly grasp the meaning of an acronym solely in their own specific discipline, they will probably encounter more difficulties when dealing with adjacent fields. It is for this purpose that this dictionary might be most often used. Scientists might also refer to this compilation in order to avoid identifying a project by an acronym which already has too many meanings or confused definitions.
Author: Maria Prudenziati
Publisher: Elsevier
ISBN: 0857096214
Category : Technology & Engineering
Languages : en
Pages : 608
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Book Description
Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications. Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices. With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. Provides a comprehensive analysis of the most significant recent developments in printed films and their applications Reviews the concepts, properties, technologies and materials involved in the production and use of printed films Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 1420036858
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Author: Taraseiskey
Publisher: CRC Press
ISBN: 1482292165
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
"Discusses the fundamental design principles, capabilities, and applications of power hybrid microcircuits and modules--detailing the operation of power semiconductor and passive components, the properties of materials, design guidelines, thermal management, and manufacturing technologies."
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 268
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Book Description
Author: Earl E. Swartzlander Jr.
Publisher: Springer Science & Business Media
ISBN: 1461316219
Category : Technology & Engineering
Languages : en
Pages : 515
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Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Author: Michael Pecht
Publisher: CRC Press
ISBN: 1498730868
Category : Technology & Engineering
Languages : en
Pages : 120
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Book Description
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
