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Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1439870926
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1439870926
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 9780367386306
Category :
Languages : en
Pages : 320
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Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader's familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early '90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system's design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1498754023
Category : Technology & Engineering
Languages : en
Pages : 374
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Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages :
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Book Description
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 9780824708658
Category : Technology & Engineering
Languages : en
Pages : 226
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Book Description
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
ISBN: 0471466093
Category : Technology & Engineering
Languages : en
Pages : 852
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Book Description
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author: Michael Jay Geier
Publisher: McGraw Hill Professional
ISBN: 0071848304
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A Fully Revised Guide to Electronics Troubleshooting and Repair Repair all kinds of electrical products, from modern digital gadgets to analog antiques, with help from this updated book. How to Diagnose and Fix Everything Electronic, Second Edition, offers expert insights, case studies, and step-by-step instruction from a lifelong electronics guru. Discover how to assemble your workbench, use the latest test equipment, zero in on and replace dead components, and handle reassembly. Instructions for specific devices, including stereos, MP3 players, digital cameras, flat-panel TVs, laptops, headsets, and mobile devices are also included in this do-it-yourself guide. Choose the proper tools and set up your workbench Ensure personal safety and use proper eye and ear protection Understand how electrical components work and why they fail Perform preliminary diagnoses based on symptoms Use test equipment, including digital multimeters, ESR meters, frequency counters, and oscilloscopes Interpret block, schematic, and pictorial diagrams Disassemble products and identify sections Analyze circuits, locate faults, and replace dead parts Re-establish connections and reassemble devices
Author: Mckeown
Publisher: CRC Press
ISBN: 9780824770334
Category : Technology & Engineering
Languages : en
Pages : 382
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Book Description
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Author: Ronald Huston
Publisher: CRC Press
ISBN: 1000611787
Category : Law
Languages : en
Pages : 297
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Book Description
Research and study in biomechanics has grown dramatically in recent years, to the extent that students, researchers, and practitioners in biomechanics now outnumber those working in the underlying discipline of mechanics itself. Filling a void in the current literature on this specialized niche, Principles of Biomechanics provides readers with a so
Author: Kuppan Thulukkanam
Publisher: CRC Press
ISBN: 1439842124
Category : Technology & Engineering
Languages : en
Pages : 1275
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Book Description
Completely revised and updated to reflect current advances in heat exchanger technology, Heat Exchanger Design Handbook, Second Edition includes enhanced figures and thermal effectiveness charts, tables, new chapter, and additional topics––all while keeping the qualities that made the first edition a centerpiece of information for practicing engineers, research, engineers, academicians, designers, and manufacturers involved in heat exchange between two or more fluids. See What’s New in the Second Edition: Updated information on pressure vessel codes, manufacturer’s association standards A new chapter on heat exchanger installation, operation, and maintenance practices Classification chapter now includes coverage of scrapped surface-, graphite-, coil wound-, microscale-, and printed circuit heat exchangers Thorough revision of fabrication of shell and tube heat exchangers, heat transfer augmentation methods, fouling control concepts and inclusion of recent advances in PHEs New topics like EMbaffle®, Helixchanger®, and Twistedtube® heat exchanger, feedwater heater, steam surface condenser, rotary regenerators for HVAC applications, CAB brazing and cupro-braze radiators Without proper heat exchanger design, efficiency of cooling/heating system of plants and machineries, industrial processes and energy system can be compromised, and energy wasted. This thoroughly revised handbook offers comprehensive coverage of single-phase heat exchangers—selection, thermal design, mechanical design, corrosion and fouling, FIV, material selection and their fabrication issues, fabrication of heat exchangers, operation, and maintenance of heat exchangers —all in one volume.
