Modeling, Design, and Fabrication of Carbon Nanostructures for Next-generation Integrated Circuit Interconnects and Passive Devices PDF Download
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Author: Hong Li
Publisher:
ISBN: 9781267767684
Category :
Languages : en
Pages : 230
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Book Description
The semiconductor industry is confronting an acute problem in the interconnect area--as IC feature sizes continue to be scaled below 22 nm, Cu wires exhibit significant "size effects" resulting in a sharp rise in their resistivity, which in turn has adverse impact both on IC performance and reliability.
Author: Hong Li
Publisher:
ISBN: 9781267767684
Category :
Languages : en
Pages : 230
Get Book
Book Description
The semiconductor industry is confronting an acute problem in the interconnect area--as IC feature sizes continue to be scaled below 22 nm, Cu wires exhibit significant "size effects" resulting in a sharp rise in their resistivity, which in turn has adverse impact both on IC performance and reliability.
Author: Sandip Bhattacharya
Publisher: CRC Press
ISBN: 1003817092
Category : Technology & Engineering
Languages : en
Pages : 251
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Book Description
Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes Hybrid CNT and GNR based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.
Author: P. Uma Sathyakam
Publisher: Springer Nature
ISBN: 9811588880
Category : Technology & Engineering
Languages : en
Pages : 134
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Book Description
This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Author: Aida Todri-Sanial
Publisher: Springer
ISBN: 3319297465
Category : Technology & Engineering
Languages : en
Pages : 333
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Book Description
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Author: Ashok Srivastava
Publisher: CRC Press
ISBN: 9814613118
Category : Science
Languages : en
Pages : 156
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Book Description
Discovery of one-dimensional material carbon nanotubes in 1991 by the Japanese physicist Dr. Sumio Iijima has resulted in voluminous research in the field of carbon nanotubes for numerous applications, including possible replacement of silicon used in the fabrication of CMOS chips. One interesting feature of carbon nanotubes is that these can be metallic or semiconducting with a bandgap depending on their diameter. In search of non-classical devices and related technologies, both carbon nanotube-based field-effect transistors and metallic carbon nanotube interconnects are being explored extensively for emerging logic devices and very large-scale integration. Although various models for carbon nanotube-based transistors and interconnects have been proposed in the literature, an integrated approach to make them compatible with the present simulators is yet to be achieved. This book makes an attempt in this direction for the carbon-based electronics through fundamentals of solid-state physics and devices.
Author: Albert Lin
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 166
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Book Description
Carbon Nanotube Field Effect Transistor (CNFET) technology has received a lot of attention in the past few years as a promising extension to silicon-CMOS for future digital logic integrated circuits. While recent research has advanced CNFET technology past many important milestones, robust and scalable solutions must be developed to realize the full potential of CNFETs. Thus, this thesis aims to develop a suite of techniques, spanning from material synthesis to circuit solutions, compatible with very-large-scale integration (VLSI). Specifically, to enable the real-world engineering of carbon nanotube integrated circuits, this thesis presents (1) wafer-scale aligned CNT growth, (2) wafer-scale CNT Transfer, (3) wafer-scale device and circuit fabrication techniques, and (4) ACCNT, a VLSI-compatible circuit design solution to surmounting the problem of metallic CNTs. These techniques culminated in the successful demonstration of CNT transistors, inverters, and NAND logic gates on a wafer scale. Furthermore, this thesis sheds light on important design considerations for the demonstration of a simple CNT "computer" and suggests a few critical directions for future work in the field of carbon nanotube technology. In contributing the above, this thesis hopes to propel carbon nanotube technology forward towards the vision of robust, large-scale integrated circuits using high-density carbon nanotubes.
Author: Dr. R. Femi
Publisher: Ashok Yakkaldevi
ISBN: 1312718463
Category : Art
Languages : en
Pages : 100
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Book Description
Electrical and Electronics Components using Copper (Cu) and Aluminium (Al) as a conducting material for many decades. This work presents the use of Carbon Nano Tubes (CNT) material to replace the traditional electrical and electronics conductive material. Also this work extensively reviewed the use of CNTs for the applications such as transformers, inductors, cables, connectors and motors which can considerably reduce the size and weight of the electrical components. Also, CNTs can be used as a electrical interconnect and bond wire material in electronics semiconductor devices. CNTs are promising conductive material for next generation electrical and electronics devices
Author: Ali Javey
Publisher: Springer
ISBN: 9780387563978
Category : Technology & Engineering
Languages : en
Pages : 267
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Book Description
This book provides a complete overview of the field of carbon nanotube electronics. It covers materials and physical properties, synthesis and fabrication processes, devices and circuits, modeling, and finally novel applications of nanotube-based electronics. The book introduces fundamental device physics and circuit concepts of 1-D electronics. At the same time it provides specific examples of the state-of-the-art nanotube devices.
Author: Mladen Božanić
Publisher: Springer Nature
ISBN: 3030443981
Category : Technology & Engineering
Languages : en
Pages : 259
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Book Description
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
Author: B.K. Kaushik
Publisher: Springer
ISBN: 9811008000
Category : Technology & Engineering
Languages : en
Pages : 116
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Book Description
The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
