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Author: Farhang Yazdani
Publisher:
ISBN: 9783319757681
Category : Heterogeneous distributed computing systems
Languages : en
Pages : 177
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Book Description
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
Author: Farhang Yazdani
Publisher:
ISBN: 9783319757681
Category : Heterogeneous distributed computing systems
Languages : en
Pages : 177
Get Book
Book Description
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
Author: Farhang Yazdani
Publisher: Springer
ISBN: 3319757695
Category : Technology & Engineering
Languages : en
Pages : 177
Get Book
Book Description
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Author: Shulu Chen
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 186
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Book Description
Since the invention of the integrated circuit (IC) in the late 1950s, the semiconductor industry has experienced dramatic growth driven by both technology and manufacturing improvements. Over the past 40 years, the industry's growth trend has been predicted by Moore's law, and driven by the constant electrical field scaling design methodology. While the intrinsic performance of each device improves over generations, the corresponding interconnects do not. To alleviate this interconnect issue, a three-dimensional (3D) integration concept of transforming longer side to side interconnects into shorter vertical vias by using multiple active layers has attracted much attention. The focus of this thesis is on providing the foundation for 3D heterogeneous integration by investigating methods of growing single crystal materials on the silicon platform and the subsequent low-temperature process flow, through experimental demonstration, theoretical modeling and device structure simplification. First, thin film single crystal GaAs and GaSb were grown on dielectric layers on bulk silicon substrates by the rapid melt growth (RMG) method, using both rapid thermal annealing (RTA) and laser annealing. The relationship between stoichiometry and the crystal structure is discussed according to the theoretical phase diagram and the experimental results. A modified RMG structure is also proposed and demonstrated to solve the potential issue involved in integrating the RMG method into a three-dimensional integrated circuits (3D-IC) process with thick isolation layers. In order to estimate the outcome of the crystallization and to provide further understanding of the physics behind this RMG process, compact models are derived based on classical crystallization theory. Mathematical models including the geometry, the thermal environment and the outcome of the crystallization are built. The initial cooling rate is identified as the key factor for the RMG process. With the ability of integrating multiple materials on silicon substrates, the subsequent process flows using low-temperature-fabrication or simplified device structures are proposed and evaluated to achieve high density 3D integration. A "bonding substrate/monolithic contact" approach is proposed to relieve the thermal constraint from getting the starting single crystal layer without sacrificing the interconnect performance. A low-temperature process using germanium as the channel material is also discussed. Finally, gated thin film resistor structures are designed and compared to the conventional MOSFET structure with a focus on their relative performance and process complexity trade-off for future 3D-IC implementation.
Author: Pranas Zunde
Publisher: Springer Science & Business Media
ISBN: 1468458620
Category : Computers
Languages : en
Pages : 455
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Book Description
This is the proceedings of the Sixth Symposium on Empirical Foundations of Information and Software Sciences (EFISS), which was held in Atlanta, Georgia, on October 19-21, 1988. The purpose of the symposia is to explore subjects and methods of scientific inquiry which are of common interest to information and software sciences, and to identify directions of research that would benefit from the mutual interaction of these two disciplines. The main theme of the sixth symposium was modeling in information and software engineering, with emphasis on methods and tools of modeling. The symposium covered topics such as models of individual and organizational users of information systems, methods of selecting appropriate types of models for a given type of users and a given type of tasks, deriving models from records of system usage, modeling system evolution, constructing user and task models for adaptive systems, and models of system architectures. This symposium was sponsored by the School of Information and Computer Science of the Georgia Institute of Technology and by the U.S. Army Institute for Research in Management Information, Communications, and Computer Sciences (AIRMICS). 17le Editors vii CONTENTS 1 I. KEYNOTE ADDRESS ............................................. .
Author: Lu Qin
Publisher: Springer Nature
ISBN: 3030611337
Category : Computers
Languages : en
Pages : 203
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Book Description
This book constitutes refereed proceedings of the 4th International Workshop on Software Foundations for Data Interoperability, SFDI 2020, and 2nd International Workshop on Large Scale Graph Data Analytics, LSGDA 2020, held in Conjunction with VLDB 2020, in September 2020. Due to the COVID-19 pandemic the conference was held online. The 11 full papers and 4 short papers were thoroughly reviewed and selected from 38 submissions. The volme presents original research and application papers on the development of novel graph analytics models, scalable graph analytics techniques and systems, data integration, and data exchange.
Author: Richard F. Paige
Publisher: Springer
ISBN: 3642026745
Category : Computers
Languages : en
Pages : 349
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Book Description
The ?fth edition of the European Conference on Model-Driven Architecture Foundations and Applications (ECMDA-FA 2009) was dedicated to furthering the state of knowledge and fostering the industrialization of Model-Driven - chitecture (MDA) and Model-Driven Engineering (MDE). MDA is an initiative proposed by the Object Management Group for platform-generic systems - velopment; MDA is one of a class of approaches under the umbrella of MDE. MDE and MDA promote the use of models in the speci?cation, design, analysis, synthesis, deployment, and evolution of complex software systems. It is a pleasure to be able to introduce the proceedings of ECMDA-FA 2009. ECMDA-FA 2009 addressed various MDA areas including model transfor- tions, modelling language issues, modelling of behavior and time, traceability and scalability, model-basedembedded systems engineering,and the application of model-driven development to IT and networking systems. ECMDA-FA 2009 focused on engaging key European and international - searchers and practitioners in a dialogue which will result in a stronger, more e?cientindustry,producingmorereliablesoftwareonthebasisofstate-of-the-art research results. ECMDA-FA is a forum for exchanging information, discussing the latest results and arguing about future developments of MDA and MDE. Particularly, it is one of the few venues that engages both leading academic researchers and industry practitioners, with the intent of creating synergies.
Author: Mohand-Said Hacid
Publisher: Springer
ISBN: 3540319492
Category : Computers
Languages : en
Pages : 706
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Book Description
This volume contains the papers selected for presentation at the 15th International Symposium on Methodologies for Intelligent Systems, ISMIS 2005, held in Saratoga Springs, New York, 25–28 May, 2005.
Author: Guo Qi Zhang
Publisher: Springer Science & Business Media
ISBN: 0387755934
Category : Technology & Engineering
Languages : en
Pages : 338
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Book Description
In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Author: Radoslaw Katarzyniak
Publisher: Springer
ISBN: 3642039588
Category : Computers
Languages : en
Pages : 349
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Book Description
Collective intelligence has become one of major research issues studied by today’s and future computer science. Computational collective intelligence is understood as this form of group intellectual activity that emerges from collaboration and compe- tion of many artificial individuals. Robotics, artificial intelligence, artificial cognition and group working try to create efficient models for collective intelligence in which it emerges from sets of actions carried out by more or less intelligent individuals. The major methodological, theoretical and practical aspects underlying computational collective intelligence are group decision making, collective action coordination, collective competition and knowledge description, transfer and integration. Obviously, the application of multiple computational technologies such as fuzzy systems, evo- tionary computation, neural systems, consensus theory, knowledge representation etc. is necessary to create new forms of computational collective intelligence and support existing ones. Three subfields of application of computational technologies to support forms of collective intelligence are of special attention to us. The first one is semantic web treated as an advanced tool that increases the collective intelligence in networking environments. The second one covers social networks modeling and analysis, where social networks are this area of in which various forms of computational collective intelligence emerges in a natural way. The third subfield relates us to agent and mul- agent systems understood as this computational and modeling paradigm which is especially tailored to capture the nature of computational collective intelligence in populations of autonomous individuals.
Author: Robert B. France
Publisher: Springer Science & Business Media
ISBN: 364221469X
Category : Computers
Languages : en
Pages : 408
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Book Description
This book constitutes the refereed proceedings of the 7th European Conference on Modelling Foundations and Applications, held in Birmingham, UK, in June 2011. The 19 revised full foundations track papers and 5 revised full applications track papers presented were carefully reviewed and selected from 61 submissions; also included are 5 workshop summaries and abstracts of 4 tutorials. The papers are organized in topical sections on model execution, model analysis, methodology, model management, model transformation, variability analysis and ADLs, and domain-specific modeling.
