Failure Modes and Mechanisms in Electronic Packages PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Failure Modes and Mechanisms in Electronic Packages PDF full book. Access full book title Failure Modes and Mechanisms in Electronic Packages by P. Singh. Download full books in PDF and EPUB format.
Author: P. Singh
Publisher: Springer Science & Business Media
ISBN: 1461560292
Category : Technology & Engineering
Languages : en
Pages : 391
Get Book
Book Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author: P. Singh
Publisher: Springer Science & Business Media
ISBN: 1461560292
Category : Technology & Engineering
Languages : en
Pages : 391
Get Book
Book Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author: Perry L. Martin
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776
Get Book
Book Description
Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author:
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
Get Book
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1315351080
Category : Technology & Engineering
Languages : en
Pages : 335
Get Book
Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Author: Xingyou Tian
Publisher: John Wiley & Sons
ISBN: 3527352422
Category : Technology & Engineering
Languages : en
Pages : 373
Get Book
Book Description
Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Get Book
Book Description
Includes bibliographical references and index.
Author: John Moalli
Publisher: William Andrew
ISBN: 081551865X
Category : Technology & Engineering
Languages : en
Pages : 345
Get Book
Book Description
This book contains analysis of reasons that cause products to fail. General methods of product failure evaluation give powerful tools in product improvement. Such methods, discussed in the book, include practical risk analysis, failure mode and effect analysis, preliminary hazard analysis, progressive failure analysis, fault tree analysis, mean time between failures, Wohler curves, finite element analysis, cohesive zone model, crack propagation kinetics, time-temperature collectives, quantitative characterization of fatigue damage, and fracture maps. Methods of failure analysis are critical to for material improvement and they are broadly discussed in this book. Fractography of plastics is relatively a new field which has many commonalities with fractography of metals. Here various aspects of fractography of plastics and metals are compared and contrasted. Fractography application in studies of static and cycling loading of ABS is also discussed. Other methods include SEM, SAXS, FTIR, DSC, DMA, GC/MS, optical microscopy, fatigue behavior, multiaxial stress, residual stress analysis, punch resistance, creep-rupture, impact, oxidative induction time, craze testing, defect analysis, fracture toughness, activation energy of degradation. Many references are given in this book to real products and real cases of their failure. The products discussed include office equipment, automotive compressed fuel gas system, pipes, polymer blends, blow molded parts, layered, cross-ply and continuous fiber composites, printed circuits, electronic packages, hip implants, blown and multilayered films, construction materials, component housings, brake cups, composite pressure vessels, swamp coolers, electrical cables, plumbing fittings, medical devices, medical packaging, strapping tapes, balloons, marine coatings, thermal switches, pressure relief membranes, pharmaceutical products, window profiles, and bone cements.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1439870926
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Get Book
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Yan Li
Publisher: Springer
ISBN: 3319445863
Category : Technology & Engineering
Languages : en
Pages : 463
Get Book
Book Description
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
