Author: John E. Traister
Publisher:
ISBN:
Category : Printed circuits
Languages : en
Pages : 468

Get Book

Book Description

Author: John Traister
Publisher: Elsevier
ISBN: 032314165X
Category : Technology & Engineering
Languages : en
Pages : 326

Get Book

Book Description
Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

Author: Vern Solberg
Publisher:
ISBN:
Category : Printed circuits
Languages : en
Pages : 146

Get Book

Book Description

Author: Vern Solberg
Publisher:
ISBN: 9780071566926
Category :
Languages : en
Pages :

Get Book

Book Description

Author: Vern Solberg
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 296

Get Book

Book Description
Very Good,No Highlights or Markup,all pages are intact.

Author: David Boswell
Publisher:
ISBN: 9781872422015
Category : Printed circuits
Languages : en
Pages : 89

Get Book

Book Description

Author: Ray Prasad
Publisher: Springer Science & Business Media
ISBN: 1461540844
Category : Technology & Engineering
Languages : en
Pages : 791

Get Book

Book Description
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Author: Vern Solberg
Publisher: McGraw-Hill Companies
ISBN:
Category : Printed circuits
Languages : en
Pages : 224

Get Book

Book Description

Author: Vern Solberg
Publisher: McGraw-Hill
ISBN: 9780071360456
Category : Architecture
Languages : en
Pages : 261

Get Book

Book Description

Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234

Get Book

Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.