Ceramic Interconnect Technology Handbook PDF Download
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Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 456
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 456
Get Book
Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author: Shigeyuki Somiya
Publisher: Academic Press
ISBN: 0080532942
Category : Technology & Engineering
Languages : en
Pages : 1320
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Book Description
A two-volume reference set for all ceramicists, both in research and working in industry The only definitive reference covering the entire field of advanced ceramics from fundamental science and processing to application Contributions from over 50 leading researchers from around the world This new Handbook will be an essential resource for ceramicists. It includes contributions from leading researchers around the world, and includes sections on: Basic Science of Advanced Ceramic, Functional Ceramics (electro-ceramics and optoelectro-ceramics) and engineering ceramics. Contributions from over 50 leading researchers from around the world
Author: Carl Burt
Publisher:
ISBN: 9781632380739
Category :
Languages : en
Pages : 0
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Book Description
This book discusses various aspects of ceramic materials, from basics to their industrial applications. Furthermore, the book covers their influence on latest technologies such as ceramic matrix composites, porous ceramics, sintering theory paradigm of modern ceramics, among others.
Author: R. Morrell
Publisher:
ISBN: 9780114800529
Category : Technology & Engineering
Languages : en
Pages : 370
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Book Description
Author: N.Q. Minh
Publisher: Elsevier
ISBN: 9780080540764
Category : Technology & Engineering
Languages : en
Pages : 366
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Book Description
Ceramic fuel cells, commonly known as solid oxide fuel cells (SOFCs), have been under development for a broad range of electric power generation applications. The most attractive feature of the SOFC is its clean and efficient production of electricity from a variety of fuels. The SOFC has the potential to be manufactured and operated cost-effectively. The widening interest in this technology, thus, arises from the continuing need to develop cleaner and more efficient means of converting energy sources into useful forms. This topical book provides a comprehensive treatise on solid oxide fuel cells and succeeds successfully in filling the gap in the market for a reference book in this field. Directed towards scientists, engineers, and technical managers working with SOFCs as well as ceramic devices based on conducting materials, and in related fields, the book will also be invaluable as a textbook for science and engineering courses.
Author: Jaromir Mike Kusnik
Publisher:
ISBN: 9780646495231
Category : Ceramic materials
Languages : en
Pages : 0
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Book Description
Author: Alan G. King
Publisher: William Andrew
ISBN: 0815516339
Category : Technology & Engineering
Languages : en
Pages : 533
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Book Description
Perfect for the new technician or engineer entering the ceramics industry as well as for the ""old hand"" who needs an update on some aspect of ceramics processing, this resource provides practical laboratory-oriented answers to such typical processing problems as particle segregation, agglomeration, contamination, pressure gradients, adherence to tooling, and temperature gradients during drying and firing. The author examines the difficulties of practical testing and processing in the ceramic laboratory, such as vast differences in scale and equipment, and shows how to evaluate results taking such variables into account. Once the laboratory work is satisfactorily completed, the rest of the book explores serious issues involved in transferring technology from the lab bench to the plant floor and then to the customer. The author gives advice on dealing with real-life problems such as allocating human and capital resources and overcoming customer wariness of being first to try new procedures and processes. Each section contains practical, hands-on suggestions on performing and sometimes avoiding certain tasks, bringing to the reader key information that is at best sparsely available in the industry. As the author states, ""Laboratory skills are gained by hands-on experience. The intent of this book is to accelerate the process.""
Author: Mel M. Schwartz
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 584
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Book Description
Aims to bridge the gap between the technical and commercial literature available on structural ceramics, by presenting coverage of processing techniques, classes of ceramics, current mechanical property data, materials manufacture and parts fabrication and assembly methods.
Author: Arunachalam Lakshmanan
Publisher: BoD – Books on Demand
ISBN: 9535100173
Category : Technology & Engineering
Languages : en
Pages : 628
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Book Description
The chapters covered in this book include emerging new techniques on sintering. Major experts in this field contributed to this book and presented their research. Topics covered in this publication include Spark plasma sintering, Magnetic Pulsed compaction, Low Temperature Co-fired Ceramic technology for the preparation of 3-dimesinal circuits, Microwave sintering of thermistor ceramics, Synthesis of Bio-compatible ceramics, Sintering of Rare Earth Doped Bismuth Titanate Ceramics prepared by Soft Combustion, nanostructured ceramics, alternative solid-state reaction routes yielding densified bulk ceramics and nanopowders, Sintering of intermetallic superconductors such as MgB2, impurity doping in luminescence phosphors synthesized using soft techniques, etc. Other advanced sintering techniques such as radiation thermal sintering for the manufacture of thin film solid oxide fuel cells are also described.
Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9811209634
Category : Packaging
Languages : en
Pages : 1079
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Book Description
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
