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Author: Yun Ouyang
Publisher: Trans Tech Publications Ltd
ISBN: 303813953X
Category : Technology & Engineering
Languages : en
Pages : 620
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Book Description
The collection of peer reviewed papers reports the latest research achievements of printing and packaging technologies and materials. Volume is indexed by Thomson Reuters CPCI-S (WoS). The papers focused on the topics of Color Science and Technology, Image Processing Technology, Digital Technology, Process Research and Standardization, Mechanical Engineering and Numerical Control Technology, and Materials and Detection Technology. It should promote academic communication among related colleges and research institutes so as to improve the R&D capability for printing and packaging.
Author: Yun Ouyang
Publisher: Trans Tech Publications Ltd
ISBN: 303813953X
Category : Technology & Engineering
Languages : en
Pages : 620
Get Book
Book Description
The collection of peer reviewed papers reports the latest research achievements of printing and packaging technologies and materials. Volume is indexed by Thomson Reuters CPCI-S (WoS). The papers focused on the topics of Color Science and Technology, Image Processing Technology, Digital Technology, Process Research and Standardization, Mechanical Engineering and Numerical Control Technology, and Materials and Detection Technology. It should promote academic communication among related colleges and research institutes so as to improve the R&D capability for printing and packaging.
Author: Yun Ouyang
Publisher: Trans Tech Publications Ltd
ISBN: 3038267902
Category : Technology & Engineering
Languages : en
Pages : 612
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Book Description
Collection of selected, peer reviewed papers from the 2014 3rd China Academic Conference on Printing and Packaging, October 24-25, 2014, Beijing, China. The 118 papers are grouped as follows: Chapter 1: Color and Optical Science and Technology; Chapter 2: Image Processing Technology; Chapter 3: Applied Information Technologies in Digital Publishing; Chapter 4: Printing Engineering Technology; Chapter 5: Packaging Engineering Technology; Chapter 6: Food Packaging and Preservation; Chapter 7: Printing and Packaging Equipment; Chapter 8: Paper and Related Material Technology; Chapter 9: Ink and Related Material Technology; Chapter 10: Polymer-Based Materials and Related Technology
Author: Pengfei Zhao
Publisher: Springer
ISBN: 9811336636
Category : Technology & Engineering
Languages : en
Pages : 1030
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Book Description
This book includes a selection of reviewed papers presented at the 9th China Academic Conference on Printing and Packaging, which was held in November 2018 in Shandong, China. The conference was jointly organized by the China Academy of Printing Technology and Qilu University of Technology (Shandong Academy of Sciences). With 8 keynote talks and over 200 presented papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists.The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, and network technology.
Author: Pengfei Zhao
Publisher: Springer Nature
ISBN: 9811605033
Category : Technology & Engineering
Languages : en
Pages : 834
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Book Description
This book includes a selection of reviewed papers presented at the 11th China Academic Conference on Printing and Packaging, held on November 26–29, 2020, Guangzhou, China. The conference is jointly organized by China Academy of Printing Technology and South China University of Technology. With 10 keynote talks and 200 presented papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists. The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, network technology and smart manufacturing technology.
Author: Pengfei Zhao
Publisher: Springer Nature
ISBN: 9811518645
Category : Technology & Engineering
Languages : en
Pages : 883
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Book Description
This book includes a selection of peer-reviewed papers presented at the 10th China Academic Conference on Printing and Packaging, which was held in Xi'an, China, on November 14–17, 2019. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Shaanxi University of Science and Technology. With 9 keynote talks and 118 papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists. The proceedings cover the latest findings in a broad range of areas, including color science and technology, image processing technology, digital media technology, mechanical and electronic engineering, Information Engineering and Artificial Intelligence Technology, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book appeals to university researchers, R&D engineers and graduate students in the graphic arts, packaging, color science, image science, material science, computer science, digital media, and network technology.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119314135
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Pengfei Zhao
Publisher: Springer
ISBN: 981103530X
Category : Technology & Engineering
Languages : en
Pages : 1176
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Book Description
This book includes a selection of reviewed papers presented at the 2016 China Academic Conference on Printing, Packaging Engineering & Media Technology, held on November 25-27, 2016 in Xi’an, China. The conference was jointly organized by China Academy of Printing Technology, Xi’an University of Technology and Stuttgart Media University of Germany. The proceedings cover the recent outcomes on color science and technology, image processing technology, digital media technology, digital process management technology in packaging and packaging etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, material science, computer science, digital media and network technology fields.
Author: Yun Ouyang
Publisher: Springer
ISBN: 9811000727
Category : Technology & Engineering
Languages : en
Pages : 1059
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Book Description
This book includes a selection of reviewed papers presented at the 2015, 4th China Academic Conference on Printing and Packaging, which was held on October 22-24, 2015 in Hangzhou, China. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Hangzhou Dianzi University. With 3 keynote talks and 200 presented papers on graphic communications, packaging technologies and materials, the conference attracted more than 400 scientists. These proceedings cover the recent research outcomes on color science and technology, image-processing technology, digital-media technology, printing-engineering technology, packaging-engineering technology etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, materials science, computer science, digital media and network technology fields.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 969
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119313988
Category : Technology & Engineering
Languages : en
Pages : 579
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Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
