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Author: Guosheng Jiang
Publisher: Springer Science & Business Media
ISBN: 1461419638
Category : Technology & Engineering
Languages : en
Pages : 156
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Book Description
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Author: Guosheng Jiang
Publisher: Springer Science & Business Media
ISBN: 1461419638
Category : Technology & Engineering
Languages : en
Pages : 156
Get Book
Book Description
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Author: Guosheng Jiang
Publisher: Springer Science & Business Media
ISBN: 146141962X
Category : Technology & Engineering
Languages : en
Pages : 163
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Book Description
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: Xingcun Colin Tong Ph.D
Publisher: Springer
ISBN: 9781441977601
Category : Technology & Engineering
Languages : en
Pages : 618
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author:
Publisher: Advanced Thermal Solutions
ISBN: 061523660X
Category :
Languages : en
Pages : 186
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Book Description
Author: Younes Shabany
Publisher: CRC Press
ISBN: 1439814686
Category : Science
Languages : en
Pages : 526
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Book Description
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Author: Jerry E. Sergent
Publisher: McGraw Hill Professional
ISBN: 9780070266995
Category : Science
Languages : en
Pages : 370
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Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Author: Ibrahim Dinçer
Publisher: John Wiley & Sons
ISBN: 1118900243
Category : Technology & Engineering
Languages : en
Pages : 365
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Book Description
Thermal Management of Electric Vehicle Battery Systems provides a thorough examination of various conventional and cutting edge electric vehicle (EV) battery thermal management systems (including phase change material) that are currently used in the industry as well as being proposed for future EV batteries. It covers how to select the right thermal management design, configuration and parameters for the users’ battery chemistry, applications and operating conditions, and provides guidance on the setup, instrumentation and operation of their thermal management systems (TMS) in the most efficient and effective manner. This book provides the reader with the necessary information to develop a capable battery TMS that can keep the cells operating within the ideal operating temperature ranges and uniformities, while minimizing the associated energy consumption, cost and environmental impact. The procedures used are explained step-by-step, and generic and widely used parameters are utilized as much as possible to enable the reader to incorporate the conducted analyses to the systems they are working on. Also included are comprehensive thermodynamic modelling and analyses of TMSs as well as databanks of component costs and environmental impacts, which can be useful for providing new ideas on improving vehicle designs. Key features: Discusses traditional and cutting edge technologies as well as research directions Covers thermal management systems and their selection for different vehicles and applications Includes case studies and practical examples from the industry Covers thermodynamic analyses and assessment methods, including those based on energy and exergy, as well as exergoeconomic, exergoenvironmental and enviroeconomic techniques Accompanied by a website hosting codes, models, and economic and environmental databases as well as various related information Thermal Management of Electric Vehicle Battery Systems is a unique book on electric vehicle thermal management systems for researchers and practitioners in industry, and is also a suitable textbook for senior-level undergraduate and graduate courses.
Author:
Publisher:
ISBN: 9780956808608
Category : Electronic packaging
Languages : en
Pages : 557
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Book Description
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
ISBN: 9780412122712
Category : Computers
Languages : en
Pages : 632
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Book Description
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
