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3D IC Devices, Technologies, and Manufacturing

3D IC Devices, Technologies, and Manufacturing PDF Author: Hong Xiao
Publisher: Spie Society of Photo-Optical Instrumentation Engineers (Spie
ISBN: 9781510601468
Category : Three-dimensional integrated circuits
Languages : en
Pages : 220

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Book Description
This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.