1997 International Symposium on Microelectronics PDF Download
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Author:
Publisher: International Society for Hybrid Microelectronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 738
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Book Description
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author:
Publisher: International Society for Hybrid Microelectronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 738
Get Book
Book Description
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 992
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 182
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Book Description
Author:
Publisher: DIANE Publishing
ISBN: 1428918248
Category :
Languages : en
Pages : 203
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Book Description
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
ISBN: 0471466093
Category : Technology & Engineering
Languages : en
Pages : 852
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Book Description
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author:
Publisher: Universal-Publishers
ISBN: 1612336248
Category :
Languages : en
Pages : 500
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Book Description
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author:
Publisher:
ISBN:
Category : Mechatronics
Languages : en
Pages : 318
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Book Description
Author:
Publisher: John Wiley & Sons
ISBN: 0471454753
Category : Science
Languages : en
Pages : 656
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Book Description
Written to educate readers about recent advances in the area of new materials used in making products. Materials and their properties usually limit the component designer. * Presents information about all of these advanced materials that enable products to be designed in a new way * Provides a cost effective way for the design engineer to become acquainted with new materials * The material expert benefits by being aware of the latest development in all these areas so he/she can focus on further improvements
