Author: Kenneth Gilbert Stephens
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 35
Book Description
Microelectronics and Energy in the 1980s and Beyond
Ocean Thermal Energy Conversion Act of 1980
Author: United States. Congress. Senate. Committee on Commerce, Science, and Transportation
Publisher:
ISBN:
Category : Ocean thermal power plants
Languages : en
Pages : 1340
Book Description
Publisher:
ISBN:
Category : Ocean thermal power plants
Languages : en
Pages : 1340
Book Description
Porous Silicon: From Formation to Applications: Optoelectronics, Microelectronics, and Energy Technology Applications, Volume Three
Author: Ghenadii Korotcenkov
Publisher: CRC Press
ISBN: 1482264595
Category : Science
Languages : en
Pages : 431
Book Description
Porous silicon is rapidly attracting increasing interest from various fields, including optoelectronics, microelectronics, photonics, medicine, sensor and energy technologies, chemistry, and biosensing. This nanostructured and biodegradable material has a range of unique properties that make it ideal for many applications. This book, the third of a
Publisher: CRC Press
ISBN: 1482264595
Category : Science
Languages : en
Pages : 431
Book Description
Porous silicon is rapidly attracting increasing interest from various fields, including optoelectronics, microelectronics, photonics, medicine, sensor and energy technologies, chemistry, and biosensing. This nanostructured and biodegradable material has a range of unique properties that make it ideal for many applications. This book, the third of a
InfoWorld
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 96
Book Description
InfoWorld is targeted to Senior IT professionals. Content is segmented into Channels and Topic Centers. InfoWorld also celebrates people, companies, and projects.
Publisher:
ISBN:
Category :
Languages : en
Pages : 96
Book Description
InfoWorld is targeted to Senior IT professionals. Content is segmented into Channels and Topic Centers. InfoWorld also celebrates people, companies, and projects.
Beyond Late Development
Author: Alice H. Amsden
Publisher: MIT Press
ISBN: 9780262261388
Category : Business & Economics
Languages : en
Pages : 236
Book Description
A study of how latecomers catch up in high-tech industries and modern services, based on an in-depth analysis of Taiwan's premier enterprises and government policies. In this book Alice Amsden and Wan-wen Chu cover new ground by analyzing the phenomenon of high-end catch-up. They study how leading firms from the most advanced latecomer countries like Taiwan have increased their market share in mature high-tech industries and services. The profits that true innovators in these industries once enjoyed have already declined, but profit rates are still above average. The latecomer firm that succeeds in capturing these rents earns "second-mover" advantage. Amsden and Chu examine the successful second movers in electronics and modern services. The critical factors, they show, are the government policies and large-scale firms that drive skills, speed, and scale. R&D in Taiwan was usually undertaken in conjunction with government labs, which prepared the way for local production of the next hot, mature product. Speed in ramping up at the firm level depended on project execution capabilities and access to capital. Scale proved to be an absolute entry requirement in modern service sectors, and was crucial to win subcontracts from leading foreign firms and to secure key components from world-class suppliers in the electronics industry. The authors challenge current orthodoxy along two lines. First, they argue that government played an important role through interventions that went beyond the market model and overcame the limitations of networking. Interventions possibly promoted mature high-tech even more than mid-tech. Second, the entrepreneurs in Taiwan were nationally owned large-scale firms rather than multinational companies.
Publisher: MIT Press
ISBN: 9780262261388
Category : Business & Economics
Languages : en
Pages : 236
Book Description
A study of how latecomers catch up in high-tech industries and modern services, based on an in-depth analysis of Taiwan's premier enterprises and government policies. In this book Alice Amsden and Wan-wen Chu cover new ground by analyzing the phenomenon of high-end catch-up. They study how leading firms from the most advanced latecomer countries like Taiwan have increased their market share in mature high-tech industries and services. The profits that true innovators in these industries once enjoyed have already declined, but profit rates are still above average. The latecomer firm that succeeds in capturing these rents earns "second-mover" advantage. Amsden and Chu examine the successful second movers in electronics and modern services. The critical factors, they show, are the government policies and large-scale firms that drive skills, speed, and scale. R&D in Taiwan was usually undertaken in conjunction with government labs, which prepared the way for local production of the next hot, mature product. Speed in ramping up at the firm level depended on project execution capabilities and access to capital. Scale proved to be an absolute entry requirement in modern service sectors, and was crucial to win subcontracts from leading foreign firms and to secure key components from world-class suppliers in the electronics industry. The authors challenge current orthodoxy along two lines. First, they argue that government played an important role through interventions that went beyond the market model and overcame the limitations of networking. Interventions possibly promoted mature high-tech even more than mid-tech. Second, the entrepreneurs in Taiwan were nationally owned large-scale firms rather than multinational companies.
VLSI Technologies Through the 80s and Beyond
Author: Denis J. McGreivy
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 360
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 360
Book Description
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Author: Hengyun Zhang
Publisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436
Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Publisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436
Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Resources in Education
A Forecast of Space Technology, 1980-2000
Author:
Publisher:
ISBN:
Category : Aerospace engineering
Languages : en
Pages : 340
Book Description
Publisher:
ISBN:
Category : Aerospace engineering
Languages : en
Pages : 340
Book Description
Signals
Author:
Publisher:
ISBN:
Category : Communications, Military
Languages : en
Pages : 1168
Book Description
Publisher:
ISBN:
Category : Communications, Military
Languages : en
Pages : 1168
Book Description